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Tantalum Ta Sputtering Target

    Symbol: Ta
   Atomic number: 73
   Atomic weight: 180.95
   Boiling Point: 5425.00°C (9797.0F)
   Melting Point: 2996.00°C(5424.8F)
   Density : 16.6g/cm3 
   CAS Registry ID: 7440-25-7


Tantalum is a grayish silver, dense, ductile, very hard, easily fabricated, and highly corrosion resistant metal. It is part of the refractory metals group and occurs naturally in the mineral tantalite, always together with the chemically similar niobium.

Tantalum is almost completely immune to chemical attack at temperatures below 150°C, and is attacked only by hydrofluoric acid, acidic solutions containing the fluoride ion, and free sulphur trioxide. The element has a melting point exceeded only by tungsten and rhenium.

1. Standard: ASTM B708
2. Grand: RO5200, RO5400, RO5252(Ta-2.5W), RO5255(Ta-10W)
3. Size:Circular Targets: Diameter(50-400)mm *Thickness(5-30)mm
    Rectangular Targets: Thickness (1~50)mm*Width (1000)mm*Length (1000~2500)mm
 Product Feature: High melting point, High-density, high temperature oxidation resistance, long service life, resistance 

Chemical Compositions of tantalum target

Chemistry                                                               ppm

Designation

Chief component

Impurities maxmium

Ta

Nb

Fe

Si

Ni

W

Mo

Ti

O

C

H

N

Ta1

Remainder

300

40

30

20

40

40

20

150

40

15

20

Ta2

Remainder

800

100

100

50

200

200

50

200

100

15

100

TaNb3

Remainder

<35000

100

100

50

200

200

50

200

100

15

100

TaNb20

Remainder

170000-

230000

100

100

50

200

200

50

200

100

15

100

Ta2.5W

Remainder

400

50

30

20

30000

60

20

150

50

15

60

Ta10W

Remainder

400

50

30

20

110000

60

20

150

50

15

60

application:Tantalum sputtering target is achieved by press working to obtain tantalum sheet, highchemical purity, grain size is small,the recrystallized structure and the three axial consistency, mainlyused in optical fiber, semiconductor wafers and  integrated circuits splashshot deposition coating,tantalum target for cathode sputtering coating, high vacuum getter active materials

 

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